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ptc thermistors for overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v series/type: b59606, b59607, b59707, b59807, b59907, b5962* date: november 2011 ? epcos ag 2011. reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without epcos' prior express consent is prohibited.
applications overcurrent protection short circuit protection features qualification based on aec-q200 rev. d for type a907 thermistor chip with lead-free tinned terminations small size short response times suitable for reflow soldering only suitable for automatic placement ul approval for selcted types (case size 1210) rohs-compatible delivery mode blister tape (case size 1210) or cardboard tape (case size 0603), 180-mm reel with 8-mm tape, taping to iec 60286-3 dimensional drawings in mm eia case size 0603 solder pad eia case size 1210 solder pad overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 2 of 27 please read cautions and warnings and important notes at the end of this document.
recommended maximum dimensions (mm) overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 3 of 27 please read cautions and warnings and important notes at the end of this document.
1) measured on component soldered to standardized pcb general technical data switching cycles n 100 tolerance of r r (except a907) d r r 25 % tolerance of r r (for a907) d r r 35 % operating temperature range (v = 0) t op 40/+125 c operating temperature range (v = v max , except a907) t op 20/+85 c operating temperature range (v = v max , for a907) t op 40/+85 c electrical specifications and ordering codes approvals type i r 1) ma i s 1) ma i smax (v = v max ) a r r w r min w eia case size approvals ordering code v max = 30 v dc or v ac, v r = 24 v dc or v ac a606 90 180 0.5 27 17 1210 x b59606a0110a062 a607 70 130 0.4 55 30 1210 x b59607a0120a062 v max = 60 v dc or v ac, v r = 42 v dc or v ac a622 22 47 0.22 220 150 0603 b59622a0090a062 v max = 80 v dc or v ac, v r = 63 v dc or v ac a623 15 33 0.15 470 300 0603 b59623a0090a062 a707 50 90 0.3 125 75 1210 x b59707a0120a062 v max = 265 v dc or v ac, v r = 230 v dc or v ac a807 15 40 0.2 400 200 1210 x b59807a0090a062 v max = 400 v dc or v ac, v r = 230 v dc or v ac a907 12 22 0.15 1500 640 1210 x b59907a0120a062 overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 4 of 27 please read cautions and warnings and important notes at the end of this document.
reliability data test standard test conditions d r 25 /r 25 electrical endurance, cycling iec 60738-1 room temperature, i smax ; v max number of cycles: 100 < 25% electrical endurance, constant iec 60738-1 storage at v max /t op,max (v max ) test duration: 1000 h < 25% damp heat iec 60738-1 temperature of air: 40 c relative humidity of air: 93% duration: 56 days test according to iec 60068-2-78 < 10% rapid change of temperature iec 60738-1 t 1 = t op,min (0 v), t 2 = t op,max (0 v) number of cycles: 5 test duration: 30 min test according to iec 60068-2-14, test na < 10% vibration iec 60738-1 frequency range: 10 to 55 hz displacement amplitude: 0.75 mm test duration: 3 2 h test according to iec 60068-2-6, test fc < 5% shock iec 60738-1 acceleration: 390 m/s 2 pulse duration: 6 ms; 6 4000 pulses < 5% climatic sequence iec 60738-1 dry heat: t = t op,max (0 v) test duration: 16 h damp heat first cycle cold: t = t op,min (0 v) test duration: 2 h damp heat 5 cycles tests performed according to iec 60068-2-30 < 10% bending test iec 60738-1 components reflow-soldered to test board maximum bending: 2 mm test according to iec 60068-2-21, test ue < 10% adhesive strength on pcb a shear force of 5 n is applied perpendicular to the longitudinal axis of the component which is soldered on pcb. no visible damage overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 5 of 27 please read cautions and warnings and important notes at the end of this document.
characteristics (typical) for a606, a607 and a707 ptc resistance r ptc versus ptc temperature t ptc (measured at low signal voltage) switching time t s versus switching current i s (measured at 25 c in still air) rated current i r versus ambient temperature t a (measured in still air) overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 6 of 27 please read cautions and warnings and important notes at the end of this document.
characteristics (typical) for a807 ptc resistance r ptc versus ptc temperature t ptc (measured at low signal voltage) switching time t s versus switching current i s (measured at 25 c in still air) rated current i r versus ambient temperature t a (measured in still air) overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 7 of 27 please read cautions and warnings and important notes at the end of this document.
characteristics (typical) for a907 ptc resistance r ptc versus ptc temperature t ptc (measured at low signal voltage) switching time t s versus switching current i s (measured at 25 c in still air) rated current i r versus ambient temperature t a (measured in still air) overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 8 of 27 please read cautions and warnings and important notes at the end of this document.
characteristics (typical) for a622 and a623 ptc resistance r ptc versus ptc temperature t ptc (measured at low signal voltage) switching time t s versus switching current i s (measured at 25 c in still air) rated current i r versus ambient temperature t a (measured in still air) taping and packing overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 9 of 27 please read cautions and warnings and important notes at the end of this document.
1) 0.2 mm over 10 sprocket holes many of the components presented in this data book are suitable for processing on automatic in- sertion or placement machines. these thermistors can be supplied on tape for easy handling by automatic systems. the individual modes of taping and packing will be described in the following. 1 taping of smd thermistors 1.1 blister tape (to iec 60286-3) figure 1 dimension (mm) 8-mm tape 16-mm tape tolerance (mm) 24-mm tape tolerance (mm) d 0 d 1 1.50 1.00 1.50 1.50 + 0.10/ 0 min. 1.50 1.50 + 0.10 + 0.10 p 0 p 2 p 1 4.00 2.00 4.00 4.00 2.00 12.00 0.10 1) 0.05 0.10 4.00 2.00 16.00 0.10 0.10 0.10 w 8.00 16.00 0.30 24.00 + 0.30/ 0.1 e 1.75 1.75 0.10 1.75 0.10 f 3.50 7.50 0.05 11.50 0.10 g 0.75 0.75 min. 0.75 min. a 0 x b 0 , k 0 , t 2 : the rated dimensions of the component compartment have been derived from the relevant component specification and are chosen such that the components cannot change their orientation within the tape. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 10 of 27 please read cautions and warnings and important notes at the end of this document.
part orientation in tape pocket for blister tape for chip thermistors case sizes 0805 and 1210 figure 2 additional taping information for chip thermistors case sizes 0805 and 1210 reel material polystyrol (ps) tape material polystyrol (ps) or polycarbonat (pc) or pvc tape break force min. 10 n top cover tape strength min. 10 n top cover tape peel force 0.2 ... 0.6 n for 8-mm tape and 0.2 ... 0.8 n for 12-mm tape at a peel speed of 300 mm/min tape peel angle angle between top cover tape and the direction of feed during peel off: 165 ... 180 cavity play each part rests in the cavity so that the angle between the part and cavity center line is no more than 20 overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 11 of 27 please read cautions and warnings and important notes at the end of this document.
2) 0.2 mm over 10 sprocket holes. 1.2 cardboard tape (to iec 60286-3) figure 3 dimensions (mm) 8-mm tape tolerance (mm) case size 0402 0603 a 0 0.6 0.95 0.2 b 0 1.15 1.8 0.2 t 0.6 0.95 0.05 t 2 0.75 1.1 max. d 0 1.5 +0.1/ 0 p 0 4.0 4.0 0.1 2) p 2 2.0 2.0 0.05 p 1 2.0 4.0 0.1 w 8.0 0.3 e 1.75 0.1 f 3.5 0.05 g 0.75 min. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 12 of 27 please read cautions and warnings and important notes at the end of this document.
part orientation in tape pocket for cardboard tape for chip thermistors case sizes 0402 and 0603 figure 4 additional taping information reel material polystyrol (ps) tape material cardboard tape break force min. 10 n top cover tape strength min. 10 n top cover tape peel force 0.1 ... 0.65 n at a peel speed of 300 mm/min tape peel angle angle between top cover tape and the direction of feed during peel off: 165 ... 180 cavity play each part rests in the cavity so that the angle between the part and cavity center line is no more than 20 overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 13 of 27 please read cautions and warnings and important notes at the end of this document.
1.3 reel dimensions 180-mm reel with 8-mm tape figure 5 dimension 180-mm reel a 180 2/+0 w 1 8.4 +1.5/ 0 w 2 14.4 max. 330-mm reel with 16-mm tape figure 6 dimension 330-mm reel a 330 2/+0 w 1 16.4 +2.0/ 0 w 2 22.4 max. 330-mm reel with 24-mm tape figure 7 dimension 330-mm reel a 330 2/+0 w 1 24.4 min. w 2 30.4 max. 380-mm reel with 24-mm tape figure 8 dimension 380-mm reel a 380 2/+0 w 1 24.4 min. w 2 30.4 max. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 14 of 27 please read cautions and warnings and important notes at the end of this document.
mounting instructions 1 soldering 1.1 leaded ptc thermistors leaded ptc thermistors follow the solderability requirements of iec 60068-2-20. during soldering, care must be taken that the thermistors are not damaged by excessive heat. the following maximum temperatures, maximum time spans and minimum distances have to be observed: solder containing lead (snpb 60/40) lead-free solder (sn96.5ag3cu0.5) solderability solder bath temperature 230 c soldering time 3 s solder bath temperature 245 c soldering time 3 s resistance to soldering heat soldering iron temperature 350 c soldering time 3 s solder bath temperature 260 c soldering time 10 s distance to thermistor has to be 3 6 mm. under more severe soldering conditions the resistance may change. soldering conditions for wave soldering are given in chapter 1.4.1. 1.2 leadless ptc thermistors in case of ptc thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. the temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. in addition, soldering methods should be employed which permit short soldering times. soldering conditions for wave soldering are given in chapter 1.4.1. 1.3 smd ptc thermistors the notes on soldering leadless thermistors also apply to the smd versions (refer to iec 60068-2-58). soldering conditions for wave soldering are given in chapter 1.4.1., for reflow soldering in chapter 1.4.2. 1.3.1 chrome/nickel/tin terminations (sizes 0402, 0603, 0805, 1210) as shown in the figure above, the terminations consists of three metallic layers. a primary chrome layer provides for good electrical contact. "leaching" is prevented by a nickel barrier layer. the outer tin coating prevents corrosion of the nickel and ensures good component solderability. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 15 of 27 please read cautions and warnings and important notes at the end of this document.
1.3.2 test methods for wetting and resistance to soldering heat a) solder bath method according to iec 60068-2-58 applicable for smd components with wire or tag terminations. in case the smd-component does not have a completely closed housing, only the wires or tags may be immersed into the solder bath. lead-free solder (sn96.5ag3cu0.5) solder containing lead (snpb 60/40) wetting test bath temperature 250 c soldering time 3 s bath temperature 215 c soldering time 3 s resistance to soldering heat bath temperature 260 c soldering time 10 s bath temperature 260 c soldering time 10 s b) solder reflow method according to iec 60068-2-58 applicable for chip-style smd components. reflow temperature profile is stated in iec 60068-2-58, 8.1.2.1 for wetting test and 8.1.2.2 for resistance to soldering heat test. lead-free solder (sn96.5ag3cu0.5) solder containing lead (snpb 60/40) wetting test peak temperature 225 ... 235 c duration maximum 20 s peak temperature 215 c duration maximum 10 s resistance to soldering heat peak temperature 245 ... 255 c duration maximum 20 s peak temperature 235 c duration maximum 30 s overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 16 of 27 please read cautions and warnings and important notes at the end of this document.
1.3.3 placement and orientation of smds on pcb a) component placement it is recommended that the pc board should be held by means of some adequate supporting pins such as shown left to prevent the smds from being damaged or cracked. b) cracks when placing a component near an area which is apt to bend or a grid groove on the pc board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line. c) component orientation choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 17 of 27 please read cautions and warnings and important notes at the end of this document.
1.4 soldering profiles 1.4.1 wave soldering recommended temperature profile for wave soldering following iec 61760-1. applicable for lead- ed ptcs and selected smd ptcs (case sizes 3225 and 4032 as well as superior series for case sizes 0402, 0603 and 0805 limit temperature sensors). overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 18 of 27 please read cautions and warnings and important notes at the end of this document.
1.4.2 reflow soldering recommended temperature characteristic for reflow soldering following jedec j-std-020d profile feature sn-pb eutectic assembly pb-free assembly preheat and soak - temperature min t smin 100 c 150 c - temperature max t smax 150 c 200 c - time t smin to t smax 60 ... 120 s 60 ... 180 s average ramp-up rate t smax to t p 3 c/ s max. 3 c/ s max. liquidous temperature t l 183 c 217 c time at liquidous t l 60 ... 150 s 60 ... 150 s peak package body temperature t p 1) 220 c ... 235 c 2) 245 c ... 260 c 2) time (t p ) 3) within 5 c of specified classification temperature (t c ) 20 s 3) 30 s 3) average ramp-down rate t p to t smax 6 c/ s max. 6 c/ s max. time 25 c to peak temperature maximum 6 min maximum 8 min 1) tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. 2) depending on package thickness. for details please refer to jedec j-std-020d. 3) tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. note: all temperatures refer to topside of the package, measured on the package body surface. number of reflow cycles: 3 overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 19 of 27 please read cautions and warnings and important notes at the end of this document.
1.4.3 solder joint profiles for ptc theristors with chrome/nickel/tin terminations 2 storage of ptc thermistors ptc thermistors should be soldered after shipment from epcos within the time specified: use thermistor within the following period after delivery: through-hole devices (housed and leaded ptcs) 24 months motor protection sensors, glass-encapsulated sensors and probe assemblies 24 months telecom pair and quattro protectors (tpp, tqp) 24 months leadless ptc thermistors for pressure contacting 12 months leadless ptc thermistors for soldering 6 months smds in eia sizes 3225 and 4032, and for ptcs with metal tags 24 months smds in eia sizes 0402, 0603, 0805 and 1210 12 months the parts are to be left in the original packing. storage temperature: 25 ... + 45 c relative humidity: 75% annual average, 95% on 30 days in a year the solderability of the external electrodes may be deteriorated if smds are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfuric acid gas or hydro- gen sulfide). overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 20 of 27 please read cautions and warnings and important notes at the end of this document.
do not store smds where they are exposed to heat or direct sunlight. otherwise, the packing ma- terial may be deformed or smds may stick together, causing problems during mounting. after opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the components as soon as possible. 3 conductive adhesion an alternative to soldering is the gluing of thermistors with conductive adhesives. the benfit of this method is that it involves no thermal stress. the adhesives used must be chemically inert and suitable for the temperatures arising at the surface of the termistor. 4 clamp contacting pressure contacting by springs is required for applications involving frequent switching and high turn-on powers. soldering is not allowed for such applications in order to avoid operational failure in the long term. ptc thermistors for heating and motor starting have metallized surfaces for clamp contacting. 5 robustness of terminations the leads meet the requirements of iec 60068-2-21. they may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. during bending, any mechanical stress at the outlet of the leads must be removed. the bending radius should be at least 0.75 mm. tensile strength: test ua1: leads ? 0.5 mm = 5 n ? > 0.5 mm = 10 n bending strength: test ub: two 90 -bends in opposite directions at a weight of 0.25 kg. torsional strength: test uc: severity 2 the lead is bent by 90 at a distance of 6 to 6.5 mm from the thermistor body. the bending radius of the leads should be approx. 0.75 mm. two torsions of 180 each (severity 2). overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 21 of 27 please read cautions and warnings and important notes at the end of this document.
when subjecting leads to mechanical stress, the following should be observed: tensile stress on leads during mounting and operation tensile forces on the leads are to be avoided. bending of leads bending of the leads directly on the thermistor body is not permissible. a lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder joint on the thermistor body. during bending the wire must be mechanically relieved at its outlet. the bending radius should be at least 0.75 mm. twisting of leads the twisting (torsion) by 180 of a lead bent by 90 is permissible at 6 mm from the bottom of the thermistor body. 6 sealing and potting when thermistors are sealed or potted, there must be no mechanical stress through differing ther- mal expansion in the curing process and during later operation. in the curing process the upper category temperature of the thermistor must not be exceeded. it is also necessary to ensure that the potting compound is chemically inert. sealing and potting compounds may degenerate the titanate ceramic of ptc thermistors and lead to the formation of low-ohmic conduction bridges. in conjunction with a change in dissipation con- ditions due to the potting compound, local overheating may finally damage the thermistor. therefore sealing and potting should be avoided whenever possible. 7 cleaning you may use common cleaners based on organic solvents (eg dowanol or alcohol) to clean ce- ramic and solder joints. for sufficient cleaning flux must be completely removed. solvents may cause plastic encapsulations to swell or detach. so be sure to check the suitability of a solvent before using it. caution is required with ultrasonic processes. if the sound power is too high, for example, it can degrade the adhesive strength of the terminal metallization or couse the encapsulation to detach. after cleaning drying is promptly necessary. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 22 of 27 please read cautions and warnings and important notes at the end of this document.
cautions and warnings general epcos thermistors are designed for specific applications and should not be used for purposes not identified in our specifications, application notes and data books unless otherwise agreed with epcos during the design-in-phase. ensure suitability of thermistor through reliability testing during the design-in phase. the ther- mistors should be evaluated taking into consideration worst-case conditions. storage store thermistors only in original packaging. do not open the package before storage. storage conditions in original packaging: storage temperature 25 c ... +45 c, relative hu- midity 75% annual mean, maximum 95%, dew precipitation is inadmissible. avoid contamination of thermistors surface during storage, handling and processing. avoid storage of thermistor in harmful environment with effect on function on long-term opera- tion (examples given under operation precautions). use thermistor within the following period after delivery: through-hole devices (housed and leaded ptcs): 24 months motor protection sensors, glass-encapsulated sensors and probe assemblies: 24 months telecom pair and quattro protectors (tpp, tqp): 24 months leadless ptc thermistors for pressure contacting: 12 months leadless ptc thermistors for soldering: 6 months smds in eia sizes 3225 and 4032, and for ptcs with metal tags: 24 months smds in eia sizes 0402, 0603, 0805 and 1210: 12 months handling ptcs must not be dropped. chip-offs must not be caused during handling of ptcs. components must not be touched with bare hands. gloves are recommended. avoid contamination of thermistor surface during handling. soldering (where applicable) use rosin-type flux or non-activated flux. insufficient preheating may cause ceramic cracks. rapid cooling by dipping in solvent is not recommended. complete removal of flux is recommended. standard ptc heaters are not suitable for soldering. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 23 of 27 please read cautions and warnings and important notes at the end of this document.
mounting electrode must not be scratched before/during/after the mounting process. contacts and housing used for assembly with thermistor have to be clean before mounting. es- pecially grease or oil must be removed. when ptc thermistors are encapsulated with sealing material, the precautions given in chapter "mounting instructions", "sealing and potting" must be observed. when the thermistor is mounted, there must not be any foreign body between the electrode of the thermistor and the clamping contact. the minimum force of the clamping contacts pressing against the ptc must be 10 n. during operation, the thermistor?s surface temperature can be very high. ensure that adjacent components are placed at a sufficient distance from the thermistor to allow for proper cooling at the thermistors. ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of thermistor. be sure that surrounding parts and materials can withstand this temperature. avoid contamination of thermistor surface during processing. operation use thermistors only within the specified temperature operating range. use thermistors only within the specified voltage and current ranges. environmental conditions must not harm the thermistors. use thermistors only in normal at- mospheric conditions. avoid use in deoxidizing gases (chlorine gas, hydrogen sulfide gas, am- monia gas, sulfuric acid gas etc), corrosive agents, humid or salty conditions. contact with any liquids and solvents should be prevented. be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by abnormal function (e.g. use vdr for limitation of overvoltage condition). overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 24 of 27 please read cautions and warnings and important notes at the end of this document.
symbols and terms a area c th heat capacity f frequency i current i max maximum current i r rated current i ptc ptc current i r residual currrent i r,oil residual currrent in oil (for level sensors) i r,air residual currrent in air (for level sensors) i rms root-mean-square value of current i s switching current i smax maximum switching current lct lower category temperature n number (integer) n c operating cycles at v max , charging of capacitor n f switching cycles at v max , failure mode p power p 25 maximum power at 25 c p el electrical power p diss dissipation power r g generator internal resistance r min minimum resistance r r rated resistance d r r tolerance of r r r p parallel resistance r ptc ptc resistance r ref reference resistance r s series resistance r 25 resistance at 25 c r 25,match resistance matching per reel/ packing unit at 25 c d r 25 tolerance of r 25 t temperature t time t a ambient temperature t a thermal threshold time t c ferroelectric curie temperature overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 25 of 27 please read cautions and warnings and important notes at the end of this document.
t e settling time (for level sensors) t r rated temperature t sense sensing temperature t op operating temperature t ptc ptc temperature t r response time t ref reference temperature t rmin temperature at minimum resistance t s switching time t surf surface temperature uct upper category temperature v or v el voltage (with subscript only for distinction from volume) v rms root-mean-square value of voltage v bd breakdown voltage v ins insulation test voltage v link,max maximum link voltage v max maximum operating voltage v max,dyn maximum dynamic (short-time) operating voltage v meas measuring voltage v meas,max maximum measuring voltage v r rated voltage v ptc voltage drop across a ptc thermistor a temperature coefficient d tolerance, change d th dissipation factor t th thermal cooling time constant l failure rate lead spacing (in mm) abbreviations / notes surface-mount devices * to be replaced by a number in ordering codes, type designations etc. + to be replaced by a letter all dimensions are given in mm. the commas used in numerical values denote decimal points. overcurrent protection smds, eia sizes 0603 and 1210, 24 v, 42 v, 63 v and 230 v page 26 of 27 please read cautions and warnings and important notes at the end of this document.
the following applies to all products named in this publication: 1. some parts of this publication contain statements about the suitability of our products for certain areas of application . these statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. we nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . as a rule, epcos is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. for these reasons, it is always ultimately incum- bent on the customer to check and decide whether an epcos product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. we also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . in customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. the warnings, cautions and product-specific notes must be observed. 4. in order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous) . useful information on this will be found in our ma- terial data sheets on the internet (www.epcos.com/material). should you have any more de- tailed questions, please contact our sales offices. 5. we constantly strive to improve our products. consequently, the products described in this publication may change from time to time . the same is true of the corresponding product specifications. please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. we also reserve the right to discontinue production and delivery of products . consequently, we cannot guarantee that all products named in this publication will always be available. the aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "general terms of delivery for products and services in the electrical in- dustry" published by the german electrical and electronics industry association (zvei) . 7. the trade names epcos, baoke, alu-x, ceradiode, csmp, cssp, ctvs, deltacap, digisimic, dssp, formfit, miniblue, minicell, mkk, mkd, mlsc, motorcap, pcc, phasecap, phasecube, phasemod, phicap, siferrit, sifi, sikorel, silvercap, simdad, simic, simid, sineformer, siov, sip5d, sip5k, thermofuse, windcap are trade- marks registered or pending in europe and in other countries. further information will be found on the internet at www.epcos.com/trademarks. important notes page 27 of 27

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